SPIE Advanced Lithography brings together the most innovative minds in optical lithography, resists, metrology, EUV, immersion, double patterning, DFM, and imprint lithography.

SPIE Advanced Lithography 2010 concluded 25 February. Dates for 2011 are confirmed: 27 February - 4 March in San Jose, California, USA.

View the current Advanced Lithography website

Advanced Lithography 2010 featured plenary presentations from industry leaders, over 2,100 attendees, and a successful exhibition.

See information on all aspects of the 2010 event:

• Onsite News, day-by-day highlights from the event
• Technical Abstract Summary (PDF)
• Invitation from Chairs 
• Participant List
• View the proceedings from Advanced Lithography 2010 in the SPIE Digital Library

<class="head6" />The event featured conferences, courses, and an exhibition covering:

•	EUV—sources, components, yields, resists, modeling
•	Alternative Technologies—maskless, nano-imprint, directed self-assembly
•	Optical lithography—computational, double patterning, SMO, OPC, RET
•	Metrology, inspection, process control, LER/LWR, mask litho, DBM
•	Resists materials and processing, double patterning, immersion, LER
•	DFM/DPI—co-optimization, layout, electrical, methodologies

Plenary Speakers:

Kazuo Ushida President Precision Equipment Co. Nikon Corp.

Eric Chen Managing Director Silver Lake Partners

Sam Sivakumar Director of Lithography Portland Technology Development Group Intel Corp.

Symposium Chairs:

Christopher J. Progler Photronics Inc. 2010 Symposium Chair

Donis G. Flagello Nikon Research Corp. of America 2010 Symposium Co-Chair

Executive Committee
Robert D. Allen, IBM Almaden Research Ctr.
Will Conley, Freescale Semiconductor, Inc.
Mircea V. Dusa, ASML US,Inc.
Donis G. Flagello, Nikon Research Corp. of America
Daniel J. C.  Herr, Semiconductor Research Corp.
Bruno La Fontaine, GLOBALFOUNDRIES Inc.
Patrick P. Naulleau, Lawrence Berkeley National Lab.
Christopher J. Progler, Photronics, Inc.
Christopher J. Raymond, Nanometrics, Inc.
Michael L. Rieger, Synopsys, Inc.
Mark H. Somervell, Tokyo Electron America, Inc.
Alexander Starikov, I&I Consulting
Joerg Thiele, Qimonda AG (Germany)
William M. Tong, Consultant

Advisory Committee
Robert D. Allen, IBM Almaden Research Ctr.
William H. Arnold, ASML US, Inc.
Timothy A. Brunner, IBM Thomas J. Watson Research Ctr.
Ralph R. Dammel, AZ Electronic Materials USA Corp.
Roxann L. Engelstad, Univ. of Wisconson, Madison
Roderick R. Kunz, MIT Lincoln Lab.
Harry J. Levinson, Advanced Micro Devices, Inc.
Burn Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chris A. Mack, lithoguru.com
Victor Pol, Freescale Semiconductor, Inc.
Michael T. Postek, National Institute of Standards and Technology
Luc Van den Hove, IMEC (Belgium)
C. Grant Willson, The Univ. of Texas at Austin
Anthony Yen, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)